What is RF Microneedling?
Radio Frequency Microneedling using the Potenza system combines the skin-tightening benefits of traditional Radio Frequency (RF) and Microneedling treatments.
How does it work?
RF Microneedling uses a handpiece that simultaneously delivers focused RF energy to the dermis layer of the skin and pierces the skin with a cartridge of tiny gold needles in order to stimulate a skin healing cascade.
What are the benefits?
RF Microneedling results in an enhanced skin revitalization treatment versus Microneedling alone. This treatment tightens and lifts the skin as well as reduces fine lines, scars, and stretch marks.
Who are the best candidates?
The best candidates for RF Microneedling are those who are looking for mild to moderate skin tightening and those who want to reduce the appearance of scars, stretchmarks, and texture. RF Microneedling may also be a great option for those who are looking for a low downtime corrective treatment series or those who want to prevent early signs of aging.
What to expect?
Your skin will be cleansed and a topical numbing agent will be applied to the treatment area at least 45 minutes to one hour prior to the treatment. Your skin will be cleansed again and prepped with alcohol immediately before the treatment to ensure that the numbing agent and other debris are removed from the skin.
You may experience warmth and a pricking sensation and/or mild to moderate irritation and discomfort as the needles are applied to the skin and the RF energy is released. You should expect the treatment to take anywhere between a half hour to one and a half hours depending on the surface area that is being treated.
Immediately post treatment you may experience mild erythema (overall redness of the skin) and edema (swelling) of the treated area. The skin will be sensitive and require the use of gentle, hydrating products during the week following the treatment. Your regular skincare regimen can be resumed 5-7 days after the treatment.
Treatments are done in a series spaced 4 weeks apart.